Multilayer PCB recieve more than a couple of conductive copper layers which mainly comprise of inner layer cores, prepreg levels and copper foils and they? lso are melted together through heat and strain. Lamination process is probably the key to manage top quality of multilayer PCB, this process requires specific heating system and pressure regarding specific amounts of time dependent on materials used to ensure the PCB board is manufactured properly.

The multilayer PCB is the development of typically the double sided PCB with increasing complexity and density regarding components, they permitted the designers in order to produce highly intricate and compact brake lines and further advancement of blind in addition to buried via opening technology has pressed these limits even further.

With the requirements of higher precision in several apps, the demands associated with multilayer PCB maintain increasing continuously in recent years. The typical apps of multilayer published circuit boards contain Computers, Data storage space, Cell phone tranny, GPS technology, satellite tv systems and therefore on.

A-TECH will be an experienced multilayer PCB manufacturer which usually own complete multilayer PCB manufacturing procedure in house from inner layer, vacuum lamination to surface area finishes, it gives us more benefits in the competitors of global marketplace shares for multilayer printed circuit planks on quality, price and lead time. The proportion regarding multilayer PCB all of us manufactured is even more than 65%.

multilayer pcb HDI PCB, the full title is Very dense Interconnect PCB, it needs very much higher wiring density with finer search for and spacing, smaller vias and increased connection pad thickness. Blind and buried vias? design is one of their noticeable feature. HDI PCB are widely utilized for Cell phone, capsule computer, digicam, GPS UNIT, LCD module in addition to other different location.

A-TECH CIRCUITS gives HDI PCB production services to globally customers in the high end automotive industry, medical computer industry, mobile, computing and defense industry.

Currently the advanced HDI technology we used include: “Direct Laser beam Drill”(DLD) is drilling of copper coating by direct LASER laser irradiation, out-do additional laser going with conformal cover up, the copper immediate laser drilling is capable of providing higher accuracy, better gap quality and far better efficiency for HDI projects. “Copper Filled” for special bunch microvia, “Laser Immediate Imaging”(LDI) is especially designed for fine line technology, to eliminate dimensional balance problem of artwork caused by environment and material concerns.